The copper thermal pad is used to protect the chip on which it is placed and encourage heat exchange between the system and the heat sink. It can also be used as a chip sink not particularly hot or to add a thickness between the system and the heat sink.
Brand: 32F Material: Copper Thermal Conductivity: 401 w/m-k Dimensions: 15 x 15 mm. Thickness: 0.8 mm Quantity: 3
Additional information
Weight | 0.01 kg |
---|---|
Brand | 32F |
EAN | 6918423371536 |