Lead-Free Soldering Wire from ATTEN is made up of 99.3% Tin and 0.7% Copper. Solder wire is medium diameter at 0.5mm allowing for a wide range of uses from fine SMD components to large footprint through-hole parts.
Sophisticated Technology
Low Melting Point, Good Activity, High Insulation Resistance. High soldering speed can help to reduce the thermal shock to the components and lower operator’s soldering time.
Fresh Raw Materials
By using high purity Tin ingot materials + electrolytic lead and special process. Our Solder Wire can keep high soldering speed, less residue, good wettability, excellent thermal and electrical conductivity.
Safe and Reliable
Excellent oxidation-resistance, wettability and expanding capability can effective avoid bridging and solder projection. Also the efficient oxidation film can form a protect film at the surface of the welding spot to lower the oxidation reaction and keep bright welding spot.
Specification: – Diameter: 0.5mm / 0.8mm / 1mm – Core: Rosin Flux Solid Core – Composition: 99.3% Tin, 0.7% Copper – Melting Point: 217-220℃ – Weight: 50g / 100g / 500g
Package Contents: – 2x Solder Spools
Additional information
| Weight | 0.1 kg |
|---|---|
| brand | Atten |
| dimensions | 13 x 8 x 3.8 cm; 100 Grams |