These stencils are made of high quality material, can be heated by the hot air machine, it is quick and easy to modify the BGA IC.
Features:
These stencils are made of high quality stainless steel, the thickness of the steel mesh is perfect.
They can be heated by the hot air machine, these stencils are not easy to deform when heated.
There are 6 different sizes and a total of 130 pieces, enough to meet your different needs.
The specifications are marked on the surface so you can choose them comfortably.
It is specially designed for laptop, desktop, communication motherboard North-South bridge and graphics card, etc. all types of BGA chips.
Specification:
Material: stainless steel
Colour: silver.
Quantity: 130 pieces.
Approximate weight: 268 g / 9.5 oz.
Package contents:
3 x BGA stencils for 0.35 mm solder ball.
2 x BGA stencils for 0.4mm solder ball.
7 pieces x BGA stencils for 0.45 mm solder ball.
35pcs x BGA Stencils for 0.5mm Solder Ball
60pcs x BGA Stencils for 0.6mm Solder Ball
23pcs x BGA Stencils for 0.76mm Solder Ball