The copper heat pad is used to protect the chip on which it is placed and to encourage heat exchange between the system and the heatsink. It can also be used as a non-particularly hot chip heatsink or to add a thickness between the system and the heatsink.
Brand: 32F Material: Copper Thermal conductivity: 401 w/m-k Dimensions: 15 x 15 mm Thickness: 1.0 mm Quantity: 3
32F 3X Thermal Copper Pad 15 x 15 x 1 mm Copper Thermal Pad HeatSink Chip GPU CPU
HKD419.37
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- Material: Copper
- Thermal conductivity: 401 w/m-k
- Dimensions: 15 x 15 mm
- Thickness: 1.0 mm Quantity: 3
- Quantity: 3
In stock
Additional information
| Weight | 0.01 kg |
|---|---|
| brand | 32F |
| dimensions | 5 x 3 x 1 cm; 10 Grams |