Features: A heat sink is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device, thereby allowing regulation of the device’s temperature at optimal levels. In computers, heat sinks are used to cool central processing units or graphics processors. Heat sinks are used with high-power semiconductor devices, where the heat dissipation ability of the component itself is insufficient to moderate its temperature. Specifications: Material: Aluminum Fins: 16 Size: 100*100*18mm / 3.93 x 3.93 x 0.7″ Quantity: 1 Weight: 123g(approx.) Package Includes: 1 x Heat Sink
Aluminum Heat Sink Heatsink Module Cooler Fin for High Power Transistor Semiconductor Devices 3.93″(L) x 3.93″(W) x 0.7″(H) /100mm(L) x 100mm(W) x 18mm(H)
₹2,523
- Material: Made of high density aluminum.
- Overall size: 100mm (L) x 100mm (W) x 18mm (H).
- Function: Surface design maximizes cooling in contact with the air.
- The 16 pcs fins increase the sealing area and thus ensure better heat dissipation.
- Application: Computer, FET, IC, power amplifier, voltage regulator, MOSFET, SCR etc. Make sure the size and heat dissipation of the heat sink is appropriate for your component.
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