Bga Reballing Station, Bga Reballing Stencil, Practical Comfortable Portable for Bga Chip Ball Planting Laptop CPU

HKD752.48

  • Not easy to oxidize, more wearresistant, and more suitable for 9mm to 43mm BGA chip ball planting
  • This reballing station adopt high quality aluminum alloy material as structure, light and durable
  • Adjust the chip size knob and set the diversion groove to facilitate the pour out of excess tin beads
  • Used for laptop CPU, mobile phone digital products plant tin rework with BGA manual welding
  • This product is a BGA universal diagonal ball planting fixture with all aluminium alloy plating

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Feature: 1. This reballing station adopt high quality aluminum alloy material as structure, light and durable
2. This product is a BGA universal diagonal ball planting fixture with all aluminium alloy plating
3. Not easy to oxidize, more wear‑resistant, and more suitable for 9mm to 43mm BGA chip ball planting
4. Adjust the chip size knob and set the diversion groove to facilitate the pour out of excess tin beads
5. Used for laptop CPU, mobile phone digital products plant tin rework with BGA manual welding

Spec:

Item Type: BGA Reballing Station
Product Model: HT-90 90×90
Applicable Steel Mesh: Approx. 90 x 90mm / 3.5 x 3.5in
Application Chip: Minimum clamping chip: approx. 9 x 9mm / 0.4 x 0.4in, maximum clamping chip: approx. 43 x 43mm / 1.7 x 1.7in
Material: Aluminum alloy
Application: BGA manual soldering for plant tin rework of notebook computer CPU and mobile phone digital products.

Package List:
1 x BGA Reballing Station
1 x Hex Wrench

Additional information

Weight 0.36 kg
Brand

Crisis

EAN

9586494369591