oz lead-free low temperature injection solder paste
Basic product information
Packaging size: 10cm x 5cm x 1.5cm
Product weight: 35 grams
Solder paste composition: Sn: 42%, Bi: 58%
Melting point: 138°C (280F)
Advantages
1. Lead-free solder paste has good wettability, small particles, and is very easy to press and spread.
2. The adhesive has a long shelf life, and the template printing has a long shelf life.
3. Good wettability, bright, uniform and complete weld.
Application
Suitable for connectors, metal shells, motors, fuses, sensors, cables, lighting electronic components, SMT repair, BGA chip ball implantation, etc.
Product Included
1 x Lead-free syringe solder paste Sn42 Bi58
1 x push rod 2 x dispensing tools